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芯片分選機(jī),精密倒裝芯片貼片機(jī) CB-610特點(diǎn):$n Correspond to fine pitch of electrodes with mounting accuracy ± 1μm$n Correspond yo ultra-low load(0.049N)to high load (490N)without head replacement
超高精度倒裝芯片貼片機(jī) CB-700特點(diǎn): ? Ultra-low load, high-accuracy bonding ? Real-time control is possible in the low load range. As a result, bump height variation become minimized.